FPC Technical discription: layer:2 material：PI Board thickness: 0.25mm Surface finish：immersion gold Min through hole：0.3mm Min line width：0.2mm（8mil) Min line space：0.2mm(8mil) Special requirements： Product use:  mobile phone

FPC Technical discription: layer:4 material：PI Board thickness: 0.3mm Surface finish：immersion gold Min through hole：0.3mm Min line width：0.1mm（4mil) Min line space：0.1mm(4mil) Special requirements： Product use:  mobile phone

FPC Technical discription: layer:4 material：PI Board thickness: 0.3mm Surface finish：immersion gold Min through hole：0.3mm Min line width：0.15mm（6mil) Min line space：0.15mm(6mil) Special requirements： Product use:  mobile phone

FPC Technical discription: layer:1 material：PI Board thickness: 0.13mm Surface finish：HAL Min through hole：0.6mm Min line width：0.2mm（8mil) Min line space：0.2mm(8mil) Special requirements： Product use:  Car stereo

FPC Technical discription: layer:2 material：PI Board thickness: 0.15mm Surface finish：immersion gold Min through hole：0.2mm(4mil) Min line width：0.1mm（4mil) Min line space：0.1mm(4mil) Special requirements： Product use:  LCD