|
|
NO |
Item |
Craft Ability |
|
1 |
Surface Finish |
HASL,Immersion Gold,Flash Gold,Gold Plating,OSP,Immersion Tin etc. |
|
2 |
Layer |
2-30 layers |
|
3 |
Minimum Linewidth |
3mil |
|
4 |
Minimum Line space |
3mil |
|
5 |
Min space between pad to pad |
3mil |
|
6 |
Minimum hole diameter |
0.10 mm |
|
7 |
Min bonding pad diameter |
10mil |
|
8 |
Max proportion of drilling hole and board thickness |
1:12.5 |
|
9 |
Max size of finish board |
23inch*35inch |
|
10 |
Rang of finish baord’s Thickness |
0.21-7.0mm |
|
11 |
Minimun thickness of soldermask |
10um |
|
12 |
Soldermask |
Green,Yellow,Black,Blue,White,Red,transparent photosensitive,,soldermask,Strippable soldermask
|
|
13 |
Minimum linewidth of Idents |
4mil |
|
14 |
Min Height of Idents |
25mil |
|
15 |
Color of silk-screen |
White,Yellow,Black |
|
16 |
Date file format |
GERBER FILE and DRILLING FILE, PROTEL SERIES， PADS2000 SERIES， Powerpcb SERIES， ODB++ |
|
17 |
E-Testing |
100% E-Testing；High Voltage Testing |
|
18 |
Material for PCB |
High Tg Material；High Frequence（ROGERS ,TEFLON ,TACONIC ,ARLON) ；Halogen-free Material |
|
19 |
Other test |
Impedance,,Testing,Resistance,,Testing, Microsection etc., |
|
20 |
Special technological requirement |
Blind & Buried Vias and High Thickness copper | |
|
