Technical discription: layer:14 material：FR4 tg170 Board thickness: 5.0mm Surface finish：immersion gold Min through hole：0.3mm(12mil) Min line width：0.1mm（4mil) Min line space：0.1mm(4mil) Special requirements： RoHS Product use: other
PCB
Technical discription: layer:10 material：FR4 tg170 Board thickness: 1.6mm Surface finish：immersion gold Min through hole：0.15mm(6mil) Min line width：0.075mm（3mil) Min line space：0.1mm(4mil) Special requirements：buried and blind via +controlled impedance RoHS Product use: other
PCB
Technical discription: layer:8 material：FR4 Board thickness: 1.0mm Surface finish：immersion gold Min through hole：0.15mm(6mil) Min line width：0.075mm（3mil) Min line space：0.1mm(4mil) Special requirements：buried and blind via +controlled impedance RoHS Product use: other
PCB
Technical discription: layer:4 material：FR4 Board thickness: 1.0mm Surface finish：immersion silver Min through hole：0.2 Min line width：0.127 Min line space：0.1 Special requirements：immersion silver RoHS Product use:toy
PCB
Technical discription: layer:12 material：FR4 Board thickness: 1.6mm Surface finish：flash gold Min through hole：0.1mm(4mil) Min line width：0.075mm（3mil) Min line space：0.1mm(4mil) Special requirements：buried and blind via +controlled impedance RoHS
PCB
Technical discription: layer:6 material：FR4 Board thickness: 1.0mm Surface finish：immersion gold Min through hole：0.1mm(4mil) Min line width：0.1mm（4mil) Min line space：0.1mm(4mil) Special requirements：buried and blind via +controlled impedance RoHS Product use: Mobile phone
PCB
Technical discription: layer:6 material：FR4 Board thickness: 1.6mm Surface finish：lead free HAL+gold finger Min through hole：0.1mm(4mil) Min line width：0.075mm（3mil) Min line space：0.1mm(4mil) Special requirements：controlled impedance RoHS Product use: Computer
PCB
Technical discription: layer:4 material：FR4 TG170 Board thickness: 0.6mm Surface finish：immersion gold Min through hole：0.1mm(4mil) Min line width：0.1mm（4mil) Min line space：0.1mm(4mil) Special requirements：buried and blind via +controlled impedance RoHS Product use: bluetooth
PCB
Technical discription: layer:2 material：FR4 Board thickness: 4.8mm Surface finish：immersion silver Min through hole： Min line width： Min line space： Special requirements： RoHS Product use:
